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Ag Sinter Paste

Features:


-Pressureless sintering

- Low temperature sintering (250℃), high temperature service

- High connection strength

- Excellent electrical and thermal conductivity

- Alternative to high-lead solder

- RoHS compliant


Description


XY-ASP-N250 sintered silver paste adopts a unique nano-silver dispersion system, meets RoHS environmental protection requirements, can adapt to dispensing and printing processes, sintering temperature is as low as 250 ℃, does not require pressure-assisted sintering, and has high connection strength.


XY-ASP-N250 is 100% Ag after sintering, and its theoretical service temperature can reach 961℃. It can replace the existing high-lead solder applications, and has outstanding electrical and thermal conductivity. Compared with traditional solders, it can greatly increase the life of the device. It is suitable for electrical conductivity. Pressure-free sealing of power devices with higher thermal conductivity requirements, such as IGBTs, high-power LEDs, radio frequency power devices, etc., especially suitable for the third-generation semiconductor packaging applications in the electronic power field.



产品规格:


Applicable surface coatingAu,Ag
Sintering temperature (℃)200-250,Recommended 250

Atmosphere deman

Nitrogen or air

After sinteringSilver content (%)100
Maximum service temperature (℃)>400
Thermal Conductivity(W/m·K)
>200
Resistivity(μΩ·cm)<3.0

Chip connection strength(MPa)

>30

High temperature shear strength(MPa)

>30@260℃

Package

2g、5g、10g(syringe pack)

Storage

 6 months shelf life


应用:





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