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Bi58Sn42

Features:


- Low temperature eutectic solder, melting point 138°C

Strength and fatigue resistance are better than Sn63Pb37

- Brittle and less ductile

Good wettability, but susceptible to impurities, especially sensitive to Pb

- Bi is a green material





Describe:


The melting point of Bi58Sn42 eutectic solder is only 138°C. As a representative of low-temperature lead-free solder, it has important application value in industry. The use of Bi can reduce the melting point, reduce surface tension, and reduce the reaction speed of Sn and Cu, so it has good wettability; in addition, the content of Sn is relatively low, thereby reducing the risk of high Sn (such as tin whiskers), which is an ideal low temperature lead-free solder. Sn-Bi solder is sensitive to Pb. If it is polluted by Pb during the soldering process, Sn-Pb-Bi low melting point eutectic (96℃) will be easily formed at the solder interface, which will aggravate the "solder joint" of the solder joint during the solidification process. peeling" phenomenon.

Bi58Sn42 eutectic solder has higher strength and fatigue resistance than tin-lead eutectic solder, and is often used in low-temperature soldering processes (such as high-frequency head, lightning protection components, flexible boards, secondary reflow, multi-layer circuit board soldering, etc.) and Lead-free electronic product assembly welding, etc.



Solder composition and properties:


Solder Composition:

Element

Wt%

tin(Sn)

42.0±1.0

bismuth(Bi)

margin

Physical Properties:

product name

Melting point/℃

solid/liquid phase

density

 g/cm^3

Resistivity

 uΩ·m

Thermal conductivity

W/m·K

Thermal expansion coefficient

10-6/℃

tensile strength

Mpa

Bi58Sn42

138

8.56

0.383

19

15

55.16

Operation details:


- Solder taking:

   Use an anti-static jig to pick up the solder to prevent solder contamination and deformation.

- Flux Compatibility:

   Bi58Sn42 solder is compatible with the major no-clean and water-soluble electronic grade fluxes currently on the market.

Processing size: 


Thickness (t)

Typical tolerances for length, width or diameter (L/W/D)

t<0.40mm

±0.02mm

0.40mm≤ t <1.00mm

±0.03mm

t 1.00mm

±0.05mm

Thickness (t)

Thickness Typical Tolerance


conventional solder alloys

Indium alloy

t<0.05mm

±0.005mm

±0.01mm

0.05mm≤ t <0.10mm

±0.008mm

±0.01mm

0.10mm≤ t <0.20mm

±0.01mm

0.20mm≤ t <0.40mm

±0.02mm

0.40mm≤ t <1.00mm

±0.03mm

t ≥1.00mm

±5%


Storage and Product Management:                                       


-storage

The best storage temperature of this product is 25±5℃, and the relative humidity is less than or equal to 55%RH.


-Product management

Keep container tightly closed when product is not in use.


Safety:                                                      


-Please use this product with adequate ventilation and certain personal protection conditions.

-Please do not mix with other toxic chemicals.




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