Guangzhou Xianyi Electronic Technology Co.,Ltd.Providing technical consulting service and solutions

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Our preforms are widely used in aviation, military industry, optical communication, precision medical electronics, power electronics, new energy vehicles, unmanned vehicles, Internet of things and other industries. The solder preforms provided are mainly applied in the packaging of hybrid integrated circuits, semiconductor integrated circuits, filter components, microwave devices, high-power IGBT devices, connectors, sensors, optoelectronic devices metal or ceramic hermetically sealed packaging and other special metal or ceramic hermetically sealed packaging areas.

Major products include Au80Sn20, Au88Ge12, Au10Sn90, Au80Cu20, Ag72Cu28,  SAC305(Sn96.5Ag3.0Cu0.5), SAC405(Sn95.5Ag4.0Cu0.5), Sn98.5Ag1.0Cu0.5, Sn63Pb37, Sn90Sb10, Bi58Sn42, In52Sn48, In97Ag3, In100, Sn96.5Ag3.5,  Pb92.5Sn5Ag2.5, AgCu30Sn10, etc.

We offer preform with accurate composition and meiling temperature. Shapes such as disk,ring, rectangle, frame are available to meet different demands according to your applications.      

Typical solder alloy provided and its properties are shown below.

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