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Gold-Tin Thin Film Heat Sink

Features


-  Alloy film with good solderability

-  Flexible process suitable for different batches

-  Eco-friendly


Description


The gold-tin film product, which has been wildly applied to opto-electronics industry, is a kind of gold-tin solder coated submounts used as heat sinks or hermetic package lids in the packaging of devices such as power semiconductor devices and UVC LED. The thickness of gold-tin solder on bonding area can be precisely controlled and no extra solder preforms or solder paste are necessary when soldering. 

 

Technical parameters



Solder layer


Composition  

AuSn,Au:70~80±5wt.%

Thickness 

2~10 μm ± 0.5 μm

Substrate material

AlN , alumina , quartz , Si , etc.

Film system


TiW/Ni/Au, Ti/Pt/Au, Ti/Ni/Au, etc.


Applications



UVC LED

Optical Device

HPLD

 

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