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Location:Home » Products » Indium Base Solder
In97Ag3

Features:


- Low temperature eutectic solder, melting point 143℃

- Low strength and good ductility

- Good electrical and thermal conductivity

- Good fatigue resistance

- Lower surface energy, good wettability

- Rare, often used as special solder




Description:


In97Ag3 is a low temperature eutectic solder with a melting point of 143°C. In97Ag3 has a low melting point and low tensile strength. Its tensile strength is much lower than that of Sn63Pb37 and slightly higher than that of pure Sn. It is suitable for low-temperature and low-strength packaging. Like Bi, In can reduce the surface energy and has good wettability to Cu. Compared with Sn-based solder, In97Ag3 solder can inhibit the dissolution of Au or Ag. In's low melting point alloy series has become one of the main special solders for microelectronic assembly because of its low melting point, good fatigue resistance and ductility, good conductivity and thermal conductivity and high reliability, especially for glass, ceramics and other non-metals.


Indium-based solders are widely used in the brazing of electrical vacuum devices, glass, ceramics and low temperature superconducting devices. Excellent thermal conductivity, is a good thermal interface material, has important application value in LED or thermal sensor.


Solder composition and properties:   


Solder Composition:

Element

Wt%

Indium(In)

margin

Silver(Ag)

3.0±0.2

Physical Properties:

Product name

Melting point/℃

Solid phase/liquid phase

Density
g/cm^3

Resistivity
 uΩ·m

Thermal conductivity

W/m·K

Thermal expansion coefficient

10-6/℃ 

Tensile strength

 Mpa

In97Ag3

143

7.38

0.075

73

22

5.5


Operation details:


- Solder taking:

   Use an anti-static jig to pick up the solder to prevent solder contamination and deformation.


- Flux Compatibility:

   In97Ag3 solder is compatible with the major no-clean and water-soluble electronic grade fluxes currently on the market.

Processing size:



thickness(t)

Typical tolerance of length, width or diameter (L/W/D)

t<0.40mm

±0.02mm

0.40mm≤ t<1.00mm

±0.03mm

t 1.00mm

±0.05mm

thickness(t)

Typical thickness tolerance


Conventional solder alloy

Indium alloy

t<0.05mm

±0.005mm

±0.01mm

0.05mm≤ t <0.10mm

±0.008mm

±0.01mm

0.10mm≤ t <0.20mm

±0.01mm

0.20mm≤ t <0.40mm

±0.02mm

0.40mm≤ t <1.00mm

±0.03mm

t 1.00mm

±5%


Storage and Product Management:                                       


-Storage

The best storage temperature of this product is 25±5℃, and the relative humidity is less than or equal to 55%RH.


-Product management

Keep container tightly closed when product is not in use.


Safety:                                                      


-Please use this product with adequate ventilation and certain personal protection conditions.

-Please do not mix with other toxic chemicals.




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