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Au80Sn20

Features:


 -Eutectic solder, melting point 280 ℃

 -Good wettability

 -High strength

 -Good fatigue resistance

 -Excellent electrical and thermal conductivity

 -High stability and reliability

 



Description


Au80Sn20, the eutectic temperature is 280℃. Solder preforms of various shapes and sizes can be made to meet various application requirements. Gold-tin eutectic solder is suitable for applications requiring high high temperature strength and thermal fatigue resistance, and has the advantages of good wetting properties, high tensile strength, and strong corrosion resistance. Au80Sn20 has the closest melting point to high-lead solder. When using this solder on gold pads and palladium-silver pads, it can also avoid the problem of gold eating and pad peeling. Compared with low melting point lead-free eutectic solder, the solder has higher stability and reliability.


Au80Sn20 eutectic solder does not need flux in packaging and welding, which avoids the contamination and corrosion of semiconductor chips caused by the use of flux. Mainly used for optoelectronic packaging, high reliability (such as InP laser diode), high-power electronic device circuit hermetic packaging and chip packaging.


Solder composition and performance:


Solder composition:


Element

Wt%

Gold(Au)

margin

Tin(Sn)

20±0.5

 

Physical properties:

Product name

Melting point/℃

Solid phase/liquid phase

 

Density
g/cm^3

Resistivity
 uΩ·m

Thermal conductivity

W/m·K

Thermal expansion coefficient

10-6/℃

Tensile strength

 Mpa

Au80Sn20

280

14.52

0.224

57

16

276

 

Operation details:


-Solder taking:

 Use an anti-static jig to pick up the solder to prevent solder contamination and deformation.

 

-Product management

Keep container tightly closed when product is not in use.

 

Safety:


- Please use this product with adequate ventilation and certain personal protection conditions.

- Please do not mix with other toxic chemicals.


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